Dr. Fang Xiaohu received his Ph.D. degree from The Chinese University of Hong Kong in 2015. He worked as a Postdoctoral Fellow at The Chinese University of Hong Kong from 2015 to 2016, and later as a Postdoctoral Fellow at the University of Waterloo, Canada, from 2017 to 2019. In September 2021, he joined the School of Microelectronics at the Southern University of Science and Technology (SUSTech).

Dr. Fang’s research focuses on RF integrated circuits, RF front-end circuits, and high-performance microwave and millimeter-wave wireless transmitters. He has achieved a series of outstanding results in developing broadband, high-efficiency, low-cost, and reusable B5G/6G wireless RF front-end circuits. He has published over 40 papers in total, including more than 15 IEEE SCI-indexed papers as the first author or corresponding author in prestigious journals such as IEEE Transactions on Microwave Theory and Techniques (TMTT), IEEE Microwave and Wireless Components Letters (MWCL), IEEE Transactions on Circuits and Systems I (TCAS-I), and IEEE Transactions on Circuits and Systems II (TCAS-II).

Dr. Fang is a Senior Member of IEEE and serves as a reviewer for several well-known journals and conferences, including IEEE TMTT, IEEE MWCL, IEEE TCAS-I, IEEE TCAS-II, and the MTT-S International Microwave Symposium (IMS).

(1) Phased Array RF Front-End Chip Design for Massive MIMO

Massive MIMO and phased array technology are core technologies for 5G sub-6 GHz and millimeter-wave communications, and advanced active array antennas rely on high-performance RF front-end components. The research group focuses on developing PA, LNA, switches, active phase shifters, and their system integration solutions based on advanced silicon and wide-bandgap semiconductor processes.

(2) GaN-Based High-Linearity and High-Efficiency Power Amplification Technology

The group is dedicated to research on high-linearity power amplifier technology for 5G/B5G/6G MIMO base stations. Power amplifiers are the core components of high-efficiency transmitters, determining transmitter performance and efficiency. In 5G/B5G applications, PA technology faces unprecedented challenges in bandwidth, linearity, and system architecture. The group primarily develops high-linearity wideband monolithically integrated PA chips based on GaN technology for advanced communication systems such as wireless communications and wireless power transfer.

(3) Research on Low-Power Transmitter Linearization Techniques

High-efficiency power amplifiers typically operate in a large-signal compression state, which introduces significant distortion and perturbation to the transmitter output signal. Therefore, low-power linearization techniques combined with linearization algorithms are essential for the widespread adoption of massive MIMO transmitters.

2011 – 2015: Ph.D., Electronic Engineering, The Chinese University of Hong Kong

2008 – 2011: M.S., Department of Electronic Science and Technology, Huazhong University of Science and Technology

2004 – 2008: B.S., Department of Electronic Science and Technology, Huazhong University of Science and Technology

2021.09 – Present: Assistant Professor, School of Microelectronics, Southern University of Science and Technology

2020.03 – 2021.08: Associate Professor, School of Electronics and Communication Engineering, Sun Yat-sen University

2017.03 – 2019.12: Postdoctoral Fellow, University of Waterloo, Canada

2015.04 – 2016.12: Postdoctoral Fellow, Department of Electronic Engineering, The Chinese University of Hong Kong

Awarded the title of "Outstanding Communist Party Member" by the SUSTech Party Committee, July 2025.

Awarded the title of "Outstanding Communist Party Member" by the SUSTech College of Engineering Party Committee, July 2023.

Won the Second Prize in the 9th SUSTech Young Faculty Teaching Competition, which also served as the university-level selection for the Guangdong Provincial Teaching Innovation Competition.

Received the university-level Teaching Achievement Award (Second Prize) for the pedagogical project "Construction and Innovative Teaching Exploration of RF Analog Integrated Circuits Curriculum Cluster for Emerging Engineering Education".

Supervised student Shi Jie to win the Best Paper Award at the 2023 Greater Bay Area Postgraduate Conference on Advanced Electromagnetics (The 24th IEEE GZ/HK AP/MTT Postgraduate Conference).

Supervised student Dai Wenqi to win the Student Paper Award at the 2024 National Conference on Microwave and Millimeter Wave Technology.

[1] X. Fang*, H. Dong and J. Shi, "An Ultrawideband Back-Off Efficiency-Enhanced Power Amplifier Utilizing In-Band Mode Transition Between Switchless Class-G and Doherty," in IEEE Transactions on Microwave Theory and Techniques, vol. 73, no. 8, pp. 4915-4928, Aug. 2025, doi: 10.1109/TMTT.2025.3540876.  https://ieeexplore.ieee.org/document/10900590

[2] X. Fang*, W. Dai and J. Shi, "A Linear and Wideband GaN MMIC Distributed Efficient Power Amplifier Design Using Unequal Power Splitting and Bandpass Unit Network," IEEE Transactions on Microwave Theory and Techniques, vol. 73, no. 5, pp. 2681-2694, May 2025, doi: 10.1109/TMTT.2024.3480451. https://ieeexplore.ieee.org/document/10736927

[3] X. Fang*, J. Shi, C. Wei, Y. Duan, P. Li and Z. Wang, "A Linear Millimeter-Wave GaN MMIC Doherty Power Amplifier With Improved AM-AM and AM-PM Characteristics," IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 8, pp. 4597-4610, Aug. 2024, doi: 10.1109/TMTT.2023.3349206. https://ieeexplore.ieee.org/document/10403646

[4] X. Fang*, R. Chen and J. Shi, "Switchless Class-G Power Amplifiers: Generic Theory and Design Methodology Using Packaged Transistors," IEEE Transactions on Microwave Theory and Techniques, vol. 72, no. 8, pp. 4625-4637, Aug. 2024, doi: 10.1109/TMTT.2024.3351852. 

https://ieeexplore.ieee.org/document/10406210

[5] J. Shi, X. Fang*, C. Wei, T. Lin, L. Zhao and K. -K. M. Cheng, "Design of a Highly Efficient Class-F GaN MMIC Power Amplifier Using a Multi-Function Bias Network and a Harmonic-Isolation L-C Resonator," IEEE Transactions on Circuits and Systems I: Regular Papers, vol. 70, no. 12, pp. 5208-5219, Dec. 2023. https://ieeexplore.ieee.org/document/10255372