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Office:Room 525, Building C, Chongwen Park
Tel: 88010180
E-mail: yuh3@sustech.edu.cn
Prof. Yu is Vice Dean and professor of School of Microelectronics at Southern University of Science and Technology. Prof. Yu has 333 peer-reviewed and referred publications [conference (212) and journal (121)], 10 books, 9 book chapters, 1 Best Paper Award of IEEE International Conference on Advanced Robotics and Mechatronics (2022),1 Best Paper Award of IEEE WRC Symposium on Advanced Robotics and Automation (2021),2 Wu Wenjun AI Science & Technology Award (2019-2020), 1 Industry-Academia-Research Cooperation Invention Award (2018), 1 Best Paper Award of IEEE Biomedical Circuits and Systems Conference (2018), 1 Best Paper Award in ACM Transactions on Design Automation of Electronic Systems (TODAES 2010), 1 Springer PhD thesis award (advisor), 3 best paper award nominations, 3 student paper competition finalists, 4 keynote talks, 1 inventor award from semiconductor research cooperation (SRC 2009), and 20 granted patents. He is Distinguished Lecturer of IEEE Circuit and System (2017-), Associate Editor of Elsevier Integration, the VLSI Journal (2016-), Elsevier Microelectronics Journal (2016-), Scientific Reports (2016-), ACM Trans. on Embedded Computing Systems (2017-) and IEEE Trans. on Biomedical Circuits and Systems (2017-), General Co-chair of the 18th lEEE Asia Pacific Conference on Circuits and Systems(APCCAS 2022) and Technical Program Committee member of several conferences.He is a senior member of IEEE and ACM. His research with multi-million government (PI of 1 China-Most-Key,1 China-NSFC-Key;1 Singapore-NRF-CRP,2 Singapore-MOE-Tier2 etc.) and industry (Intel, Huawei, BGI etc.) fundings. His industry work at BDA is also recognized with an EDN magazine innovation award and multi-million venture capital funding.
LLM Inference on Edge.
Embodied AI Chip.
Sensing-Memory-Computing AI Chip.
05/2007-----Ph.D., Electrical Engineering, University of California, Los Angeles (UCLA), USA.
05/2005-----M.S., Electrical Engineering, University of California, Los Angeles (UCLA), USA.
07/1999-----B.S., Physics, Fudan University, P. R. China.
01/2019-----Southern University of Science and Technology, P. R. China.
Professor, Deputy Director of School of Microelectronics
06/2017-----Southern University of Science and Technology, P. R. China.
Associate Professor, Department of Electronic and Electrical Engineering
10/2010-----Nanyang Technological University, Singapore.
Assistant Professor, School of Electrical and Electronic Engineering
Program Director of VIRTUS IC Design Center of Excellence
Program Director of VALENS Biomedical Center of Excellence
Cluster Director of Energy Research Institute @ NTU
Best Paper Award, IEEE International Conference on Advanced Robotics and Mechatronics (ICARM), 2022.
Best Paper Award, IEEE WRC Symposium on Advanced Robotics and Automation (WRC SARA), 2021.
10th WU Wen-Jun AI Science & Technology Award for AI Chip, 2020.
9th WU Wen-Jun AI Science & Technology Award for Technology Invention, 2019.
Invention Award, Chinese Industry- Academia-Research Cooperation, 2018
Best Paper Award, IEEE Biomedical Circuits and Systems Conference, 2018.
Distinguished Lecturer of IEEE Circuits and Systems Society, 2017-2019.
Best Paper Award at ACM Trans. on Design Automation of Electronic Systems, 2010.
Inventor Award at Semiconductor Research Cooperation (SRC), 2009.
1.Kai Li, Mingqiang Huang, Ang Li, Shuxin Yang, Quan Cheng, Hao Yu*, "A 29.12 TOPS/WVector Systolic Accelerator with NASoptimized DNNs in 28-nm CMoS", IEEE Journal of Solid-State Circuits (JSSC), 2025.(Impact Factor 6.12)
2.Hao Yu, Leibin Ni and Sai Manoj Pudukotai Dinakarrao, ReRAM-based Machine Learning, IET 2020. (ISBN: 978-1-83953-081-4)
3.Hao Yu, and Chuan Seng Tan, Advances in 3D Integrated Circuits and Systems, World Scientific Publishing 2015. (ISBN: 978-981-4699-00-6)
4.Yixing Li, Zichuan Liu, Wenye Liu, Yu Jiang, Yongliang Wang, Hao Yu and Fengbo Ren, "A 34-FPS 698-GOP/s/W Binarized Deep Neural Network-based Natural Scene Text Interpretation Accelerator for Mobile Edge Computing", IEEE Transactions on Industrial Electronics, vol.66, no.9, pp.7407-7416, September 2019. (Impact Factor 7.00)
5.Hantao Huang, and Hao Yu*,"LTNN: A Layer-wise Tensorized Compression of Multilayer Neural Network", IEEE Transactions on Neural Networks and Learning Systems, vol.30, no.5, pp.1497-1511, May 2019. (Impact Factor 7.98)